流程簡介：開料－－鑽孔－－乾膜製程－－壓合－－減銅－－電鍍－－塞孔－－防焊(綠漆/綠油)
－－鍍金－－噴錫－－成型－－開短路測試－－終檢－－雷射鑽孔
a.開料( cut lamination)
a-1裁板( sheets cutting)
a-2原物料發料(panel)(shear material to size)
b.鑽孔(drilling)
b-1內鑽(inner layer drilling )
b-2一次孔(outer layer drilling )
b-3二次孔(2nd drilling)
b-4雷射鑽孔(laser drilling )(laser ablation )
b-5盲(埋)孔鑽孔(blind & buried hole drilling)
c.乾膜製程( photo process(d/f))
c-1前處理(pretreatment)
c-2壓膜(dry film lamination)
c-3**(exposure)
c-4顯影(developing)
c-5蝕銅(etching)
c-6去膜(stripping)
c-7初檢( touch-up)
c-8化學前處理,化學研磨( chemical milling )
c-9選擇性浸金壓膜(selective gold dry film lamination)
c-10顯影(developing )
c-11去膜(stripping )
developing , etching & stripping ( des )
d.壓合lamination
d-1黑化(black oxide treatment)
d-2微蝕(microetching)
d-3鉚釘組合(eyelet )
d-4疊板(lay up)
d-5壓合(lamination)
d-6後處理(post treatment)
d-7黑氧化( black oxide removal )
d-8銑靶(spot face)
d-9去溢膠(resin flush removal)
e.減銅(copper reduction)
e-1薄化銅(copper reduction)
f.電鍍(horizontal electrolytic plating)
f-1水平電鍍(horizontal electro-plating) (panel plating)
f-2錫鉛電鍍( tin-lead plating ) (pattern plating)
f-3低於1 mil ( less than 1 mil thickness )
f-4高於1 mil ( more than 1 mil thickness)
f-5砂帶研磨(belt sanding)
f-6剝錫鉛( tin-lead stripping)
f-7微切片( microsection)
g.塞孔(plug hole)
g-1印刷( ink print )
g-2預烤(precure)
g-3表面刷磨(scrub)
g-4後烘烤(postcure)
h.防焊(綠漆/綠油): (solder mask)
h-1 c面印刷(printing top side)
h-2 s面印刷(printing bottom side)
h-3靜電噴塗(spray coating)
h-4前處理(pretreatment)
h-5預烤(precure)
h-6**(exposure)
h-7顯影(develop)
h-8後烘烤(postcure)
h-9 uv烘烤(uv cure)
h-10文字印刷( printing of legend )
h-11噴砂( pumice)(wet blasting)
h-12印可剝離防焊(peelable solder mask)
i .鍍金gold plating
i-1金手指鍍鎳金( gold finger )
i-2電鍍軟金(soft ni/au plating)
i-3浸鎳金( immersion ni/au) (electroless ni/au)
j.噴錫(hot air solder leveling)
j-1水平噴錫(horizontal hot air solder leveling)
j-2垂直噴錫( vertical hot air solder leveling)
j-3超級焊錫(super solder )
j-4.印焊錫突點(solder bump)
k.成型(profile)(form)
k-1撈型(n/c routing ) (milling)
k-2模具衝(punch)
k-3板麵清洗烘烤(cleaning & backing)
k-4 v型槽( v-cut)(v-scoring)
k-5金手指斜邊( beveling of g/f)
l.開短路測試(electrical testing) (continuity & insulation testing)
l-1 aoi光學檢查( aoi inspection)
l-2 vrs目檢(verified & repaired)
l-3泛用型治具測試(universal tester)
l-4專用治具測試(dedicated tester)
l-5飛針測試(flying probe)
m.終檢( final visual inspection)
m-1壓板翹( warpage remove)
m-2 x-out印刷(x-out marking)
m-3包裝及出貨(packing & shipping)
m-4目檢( visual inspection)
m-5清洗及烘烤( final clean & baking)
m-6護銅劑(entek cu-106a)(osp)
m-7離子殘餘量測試(ionic contamination test )(cleanliness test)
m-8冷熱衝擊試驗(thermal cycling testing)
m-9焊錫性試驗( solderability testing )
n.雷射鑽孔(laser ablation)
n-1雷射鑽tooling孔(laser ablation tooling hole)
n-2雷射**對位孔(laser ablation registration hole)
n-3雷射mask製作(laser mask)
n-4雷射鑽孔(laser ablation)
n-5 aoi檢查及vrs ( aoi inspection & verified & repaired)
n-6 blaser aoi (after desmear and microetching)
n-7除膠渣(desmear)
n-8微蝕(microetching )
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